时刻表

时区:Asia/Shanghai

32021年08月27日星期五

P1

Poster 1@Poster

2021年08月27日 12:00~13:30

时刻表 V4 发布时间:2021-08-26 10:02:05

编号 标题
P1-WBG Devices
Chair: Guorong Zhu, Wuhan University of Technology / Zhen Tian, Wuhan University
20
张贴报告
26
Low Roughness SiC Trench Formed by ICP Etching with Sacrificial Oxidation and Ar Annealing Treatment
Changwei Zheng SiC Process Technolo/Zhuzhou CRRC Times Semiconductor Co. Ltd.
张贴报告
35
The influence of hydrogen annealing on minority carrier lifetimes in 4H-SiC
Ruijun Zhang/XiaMen University,Department of Physics
张贴报告
56
2
650V 4H-SiC VDMOS with Additional N Region_A Simulation Study
Xiuxiu Gao/CORESING SEMICONDUCTOR TECHNOLOGY CO . LTD
张贴报告
15
A Novel SiC Trench MOSFET Structure with Enhanced Short Circuit Robustness
Chongyu Jiang graduate student/Zhejiang University
张贴报告
31
57
21
25
148
P5

Poster 5@Poster

2021年08月27日 12:00~13:30

时刻表 V4 发布时间:2021-08-26 10:02:05

编号 标题
P5-WBG Device Applications
Chair: Song Xiong, Wuhan University of Technology / Deliang Wu, Shanghai University
22
Design of a High Power Density Bidirectional AC/DC Converter Based on GaN
Jiajia Guan/Huazhong University of Science and Technology
张贴报告
12
Dual-Side Three-stage Asymmetric Phase Shift Strategy for Bidirectional Inductive Power Transfer System with SiC Power Module
Haowen Chen student/Huazhong University of Science and Technology,School of Electrical and Electronic Engineering
张贴报告
40
A GaN-based High Power-density Power Optimizer for Solar-powered Aircraft Applications
peng chen/Nanjing University of Aeronautics and Astronautics,College of Automation
张贴报告
64
33
18
Design Methodology of SiC MOSFET Based Bidirectional CLLC Resonant Converter for Wide Battery Voltage Range
Mingjie Liu/State Key Laboratory of Advanced Electromagnetic Engineering and Technology, Huazhong University of Science and Technology, Wuhan, P. R. China
张贴报告
54
张贴报告
32
29
张贴报告
23
Active Magnetic Bearing Amplifier Design based on SiC Devices
Gang Cao/Huazhong University of Science and Technology
张贴报告
30
Design and Verification of Gate Driver for 6.5 kV SiC MOSFET Module
Yijian Wang/Huazhong University of Science and Technology
张贴报告
52
68
8
DC Transform Circuit Design Based on Multiplier Rectification
Penghui Yin/Huazhong University of Science and Technology,State Key Laboratory of Advanced Electromagnetic Engineering and Technology
张贴报告
46
LLC Resonant Converter Based on Trench Gate SiC MOSFET
Jinkun Chu/Anhui University of Technology
张贴报告
59
49
Mode Switchover Strategy for Multi-port Energy Router Based on State Flow Diagram
Zhiguo Wei/,China University of Geosciences (Wuhan)
张贴报告
42
81
An Intergrated Buck-Boost Converter with SRC for Wide Input Voltage
Yanqing Wang/China-EU Institute for Clean and Renewable Energy, Huazhong University of Science and Technology
张贴报告
P4

Poster 4@Poster

2021年08月27日 12:00~13:30

时刻表 V4 发布时间:2021-08-26 10:02:05

编号 标题
P4-WBG Device Reliability
Chair: Yi Liu, Wuhan University of Technology / Donghai Zhu, Huazhong University of Science and Technology
53
Comparison of the Influence of Reverse Conduction on EMI of WBG And Si Devices
Ru Zhang/School of Electrical Engineering, Xi’an Jiaotong University
张贴报告
4
63
9
14
张贴报告
39
Influence of CucorAl wire bonding on reliability of SiC devices
Fang Chao/Zhuzhou CRRC Times Semiconductor Co., Ltd.
张贴报告
27
60
Design of Aging Test System for SiC MOSFET Modules
Chaoyue Shen Student/Shanghai University,School of Mechatronic Engineering and Automation
张贴报告
50
48
36
EMI Noise Reduction in GaN-based Full-bridge LLC Converter
Yue Cao Student/Xi'an Jiaotong University
张贴报告
P3

Poster 3@Poster

2021年08月27日 12:00~13:30

时刻表 V4 发布时间:2021-08-26 10:02:05

编号 标题
P3-WBG Device Modeling
Chair: Zhijian Fang, China University of Geosciences / Hao Feng, Chongqing University
43
Dynamic gate leakage current of p-GaN Gate AlGaN/GaN HEMT under positive bias Conditions
Yu Sun/Institute of Microelectronics, Peking University;Chun Han/Peking University
张贴报告
44
Design, Fabrication and Characterization of 6.5 kV/100A 4H-SiC PiN Rectifier
Mengling Tao/University of Electronic Science and Technology of China
张贴报告
13
Analytical Averaged Loss Model of a Three-level NPC-type Converter With SiC Devices
Xinyue Guo/Huazhong University of Science and Technology,School of Electrical and Electronic Engineering
张贴报告
66
7
69
Modeling and comparison of switching loss between SiC MOSFETs with current source and voltage source gate driver
Quan Zheng/Huazhong University of Science and Technology,School of Electrical and Electronic Engineering
张贴报告
45
10
41
A Survey on Modeling of SiC IGBT
Yuwei Wu/Xi’an Jiaotong University
张贴报告
47
67
61
A Lossless and Passive Voltage Spikes Clamping Circuit for SiC HERIC Inverter
Yong Li/Huazhong University of Science and Technology
张贴报告
62
P2

Poster 2@Poster

2021年08月27日 12:00~13:30

时刻表 V4 发布时间:2021-08-26 10:02:05

编号 标题
P2-WBG Device Packaging
Chair: Yi Liu, Huazhong University of Science and Technology / Qingqing He, Wuhan University of Technology
24
28
Design and Research on Package Insulation of Highvoltage Silicon Carbide Module
Yang Zhou/Global Energy Interconnection Research Institute Co.,Ltd
张贴报告
55
张贴报告
17
Evaluating Switching Performance of GaN HEMT Using Analytical Modeling
Yingzhe Wu/University of Electronic Science and Technology of China
张贴报告
34
38
19
A Low Winding Loss Magnetic Circuit Structure Design of Planar Inductance for GaN-based Totem-Pole PFC
Pengyuan Ren/School of Electrical Engineering, Xi'an Jiaotong University
张贴报告
58
GaN HEMT with current-driven gate and its driving circuit design
Qingliang Song principal engineer/Infineon Technologies
张贴报告
51
Ultra-thin Coupled Inductor for a GaN-Based CRM Buck Converter
Ming Hua/Nanjing Research Institute of Electronics Technology
张贴报告
3
6
An Optimal Design Scheme of Intermediate Bus Voltage for two-stage LLC Resonant Converter Based on SiC MOSFET
feng wang/Huazhong University of Science and Technology,State Key Laboratory of Advanced Electromagnetic Engineering and Technology
张贴报告
重要日期
  • 会议日期

    08月25日

    2021

    08月27日

    2021

  • 04月21日 2021

    摘要截稿日期

  • 05月15日 2021

    摘要录用通知日期

  • 06月25日 2021

    终稿截稿日期

  • 08月24日 2021

    报告提交截止日期

  • 08月27日 2021

    注册截止日期

主办单位
IEEE
IEEE ELECTRONIC DEVICE SOCIETY
承办单位
Huazhong University of Science and Technology
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