This study proposes a novel wavy microchannel heat sink with a front single-layer and rear double-layer configuration to enhance thermal-hydraulic performance. Through multi-objective optimization using RSM, NSGA-II and TOPSIS, the optimal design (α1 = 0.2278, α2 = 0.723, A = 0.1068 mm) reduces thermal resistance by 2.34% and pressure drop by 16.49% compared to conventional double-layer designs.
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