活动简介

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. For academics and industrialists involved in both micro and power electronics this annual event promises to be a very special occasion with a high quality technical programme and exciting social events.

征稿信息

重要日期

2018-04-10
摘要截稿日期
2018-05-02
初稿截稿日期
2018-06-14
初稿录用日期
2018-08-08
终稿截稿日期

Thermal Phenomena, Simulation and Experiment

• Thermal management of electronic component and systems

• Classical and modern thermometry and thermography

• Multi-physics simulation and fi eld coupling

• Thermal interface materials

• Thermal modelling and investigation of packages

• Power electronics • High Temperature electronics

• Solid state lighting / LED’s

• Thermal characterisation of micro and nano domains

• CFD modelling and benchmarking

• Advanced thermal materials

• Heat transfer on the nano-scale

• Thermal performance of interconnects

• Temperature mapping

• Electro-thermal interactions

• Nanotechnology applications

• Flow visualisation

Electronics Cooling Concepts

• Thermo-electric cooling

• Novel and advanced cooling technologies

• Sub-ambient cooling

• Heat pipe assisted cooling

• 3D integration and cooling concepts

• Cooling concepts: air, liquid, etc.

• Ultra low form factor air cooling

• Novel manufacturing methods

Thermo-Mechanical Reliability

• Thermo-mechanical reliability

• Prognostics and health monitoring

• Lifetime modelling and prediction

• Damage and fracture mechanics

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重要日期
  • 会议日期

    09月26日

    2018

    09月28日

    2018

  • 04月10日 2018

    摘要截稿日期

  • 05月02日 2018

    初稿截稿日期

  • 06月14日 2018

    初稿录用通知日期

  • 08月08日 2018

    终稿截稿日期

  • 09月28日 2018

    注册截止日期

承办单位
Chalmers University of Technology
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