The 23rd International Symposium on Quality Electronic Design (ISQED'22) is the premier interdisciplinary and multidisciplinary Electronic Design conference—bridges the gap among Electronic/Semiconductor ecosystem members providing electronic design tools, integrated circuit technologies, semiconductor technology,packaging, assembly & test to achieve total design quality. Current and all past ISQED events have been held with the technical sponsorship of IEEE CASS, IEEE EDS, IEEE Reliability Society, and in-cooperation with ACM/SigDA. All past Conference proceedings & Papers have been published in IEEE Xplore digital library and indexed by Scopus.
General Chair
Swaroop Ghosh, Pennsylvania State University (Chair)
Organizing Committee
Kurt Schwartz, Micron Technology (Chair)
Technical Programs
Fatemeh Tehranipoor, Santa Clara University (Chair)
Abhilash Goyal, Velodyne LiDAR (Co-Chair)
Amey Kulkarni, NVIDIA (Co-Chair)
Cindy Yi, Virginia Tech (Co-Chair)
Plenary
Ali A. Iranmanesh, Silicon Valley Polytechnic Institute( Chair)
Special Sessions
Pravin Kumar Venkatesan, Velodyne LiDAR(Chair)
Prabha Sundaravadivel , UT Tyler(Co-Chair)
Rajat Subhra Chakraborty, Indian Institute of Technology(Co-Chair)
Workshops/Tutorials
José Pineda de Gyvez, NXP Semiconductors (Chair)
Yu Pu - Alibaba(Co-Chair)
Panels
Shigeki Tomishima, Intel Corporation (Chair)
Siddha Ganju, NVIDIA (Co-Chair)
Publications
Paul Wesling, IEEE(Chair)
Global Representatives
George Ph. Alexiou, University of Patras and Computer Technology Institute, Patras, Greece (Vice Chair, Europe)
Gaofeng Wang, Hangzhou Dianzi University, Hangzhou, China (Chair, China)
Shih-Hsu Huang, Chung Yuan Christian University(Chair, Taiwan)
Masahiro Fujita, University of Tokyo, Japan (Chair, Japan)
Fabiano Passuelo Hessel, Pontificia Universidade Catolica do Rio Grande do Sul, Brazil, (Chair, Brazil & South America)
Hardware and System Security (HSS)
Electronic Design Automation Tools and Methodologies (EDA)
Design Test and Verification (DTV)
Emerging Device and Process Technologies and Applications (EDPT)
Circuit Design, 3D Integration and Advanced Packaging (ICAP)
System-level Design and Methodologies (SDM)
Cognitive Computing Hardware (CCH)
Paper submission must be done on-line through the conference web site: www.isqed.org. The guidelines for the final paper format are provided on the conference web site. Authors should submit original, unpublished papers along with an abstract of about 200 words. The manuscripts should be at least four (4) pages long but not exceed six (6) pages, should not use smaller than 10pt font size, and must be consistent with the format provided in the conference website: www.isqed. org. The manuscripts longer than 6 pages and/or written in less than 10-pt font sizes will not be reviewed. To permit a blind review, do not include name(s) or affiliation(s) of the author(s) on the manuscript and abstract. The complete contact author information needs to be entered separately.
The manuscripts identifying the name and/or affiliations of the authors in the submitted manuscript will be rejected without review. Please check the as-printed appearance of your paper before sending your paper. In case of any problems email isqedisqed@gmail.com.
04月06日
2022
04月08日
2022
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