About Aerospace; Bioengineering; Components, Circuits, Devices and Systems; Photonics and Electrooptics; Power, Energy and Industry Applications; Transportation
Keywords:electronic packaging,Microelectronics,Thermal management,System in package,embedded technologies,Power electronics,Photonics,Gyroscopes And Microelectromechanical (mems) Sensors,Sensors And Actuators,Semiconductor ,RF microwave packaging,
Scope:The EMPC®2023 Conference will explore microelectronic packaging themes and is seeking research papers, technical presentations and future trends from industrialists and academics.
Sponsor Type:1; 9