2022 IEEE 4th International Conference on Circuits and Systems ICCS 2022

活动简介

Following the success of previous ICCS, 2022 4th International Conference on Circuits and Systems will take place in Chengdu, China again during September 23-26, 2022. ICCS 2022 is sponsored by IEEE Chengdu CEDA chapter and Chengdu Section, hosted by University of Electronic Science and Technology of China.

ICCS is an international networking platform for researchers in the highly active fields of theory, design and implementation of circuits and systems, to listen, learn and discuss about the most recent scientific and industrial developments and advancements in the area, to identify new issues, and to shape future directions for research. It is a perfect opportunity for PhD candidates to show the progress of their scientific work in front of the conference either as lecture or poster presentations. The congress has the focus on the frontier topics in the theoretical and applied engineering.

Sponsor Type:3; 5

组委会

CONFERENCE CHAIRS

Mohamad Sawan, Westlake University (IEEE Fellow)

Letian Huang, University of Electronic Science and Technology of China

Xinglai Ge, Southwest Jiaotong University

CONFERENCE CO-CHAIRS

Weixin Gai, Peking University

Weiqiang Liu, Nanjing University of Aeronautics and Aeronautics

PROGRAM CHAIRS

Xiaohang Wang, South China University of Technology

Wang Kang, Beihang University

PROGRAM CO-CHAIRS

Sheng Ma, National University of Defense Technology

Yong Chen, University of Macau

Li Jiang, Shanghai Jiao Tong University

Esteban Tlelo-Cuautle, INAOE

Jayakumari J., Mar Baselios College of Engineering and Technology

TRACK CHAIRS

Maliang Liu, Xidian University

Gengen Liu, Fuzhou University

Jixin Zhang, Hubei University of Technology

Yibo Fan, Fudan University

Jing Jin, Shanghai Jiao Tong University

Zhao Zhang, Institute of Semiconductors, Chinese Academy of Sciences

Yijiu Zhao, University of Electronic Science and Technology of China

Zhangyong Chen, University of Electronic Science and Technology of China

Guohua Zhou, Southwest Jiaotong University

LOCAL ORGANIZING CHAIRS

Qun Zhou, Sichuan University

Wenfu Wei, Southwest Jiaotong University

Qihong Huang, Chengdu University of Information Technology

TUTORIAL CHAIRS

Nan Qi, Institute of Semiconductors, Chinese Academy of Sciences (CAS)

Fei Gao, ShanghaiTech University

PUBLICATION CHAIR

Bo Zhao, Zhejiang University

PUBLICITY CHAIRS

Biao Pan, Beihang University

Yanlong Zhang, Xi’an Jiaotong University

TECHNICAL PROGRAM COMMITTEES

Yuan Gao, Southern University of Science and Technology, China

Hai Wang, University of Electronic Science and technology of China, China

Yun Yin, Fudan University, China

Xiaozong Huang, China Electronics Technology Group Corporation (CETC), China

Haruo Kobayashi, Gunma University, Japan

Ljiljana Trajkovic, Science Simon Fraser University, Canada

Smitha K. G., Nanyang Technological University, Singapore

Shaogang Hu, University of Electronic Science and Technology of China, China

Jingjing Liu, Sun Yat-Sen University, China

Dawei Li, South Central University for Nationalities, China

Gao Bo, Sichuan University, China

Paul Zhou, Analog Devices, USA

Leijun Xu, Jiangsu University, China

Shagun Bajoria, Eindhoven university of Technology, Netherlands

Hui Chen, University of Electronic Science and Technology of China

Chunqi Shi, East China Normal University, China

Peng Liu, Guangdong University of Technology, China

Zhiguo Yu, Jiangnan University, China

Francesco Ponzio, Polytechnic University of Turin, Italy

Yushi Zhou, Lakehead University, Canada

Zou Huan, University of Electronic Science and Technology of China, China

Hu Yuanqi, Beihang University, China

Kai Xu, Fudan University, China

Xiaoying Deng, Shenzhen University, China

Hao Cai, Southeast University, China

Hesham F. A. Hamedd, Egyptian Russian University, Egypt

Yong Jia, Chengdu University of Technology, China

Hao Gao, Eindhoven university of Technology, Netherlands

Sijun Du, Delft University of Technology, The Netherlands

征稿信息

重要日期

2022-08-15

初稿截稿日期

2022-08-25

初稿录用日期

2022-09-05

终稿截稿日期

征稿范围

All submissions must describe original research,not published or currently under review for another workshop,conference,or journal.
All accepted papers willbe published by conference proceedings.
We invite submissions of high-quality papers describing fully developed results or ongoing work on the following topics and related areas,but are not limited to:

Track 1: Analog and RF Circuits Design
Analog Circuits & Sensor Interfaces
ADCs & DACs
PLL & Clock Generators
High Speed Wireline Interface
Chaos and Applications
Log-domain Circuits
Dynamic Nonlinear Circuits
Advanced RF Building Blocks
RF/MM Receivers & Transmitters

Track 2: VLSI Design & Electronic Design Automatic
System Level Modeling & Verification
High Level Synthesis
Formal Verification
Simulation & Waveform Compression
Hardware/Software Co-Design
Application Driven Accelerators Design
FPGA based Design
Emerging Domain-Specific Digital Circuits and Systems

Track 3: Circuits and Systems for Signal Processing
Circuits and Systems for Image Processing
Circuits and Systems for Audio & Video Compression/ Enhancement
Circuits and Systems for Audio & Video Analysis /Recognition/ Reconstruction
Biomedical Image Processing System
Body and Brain Interfaces
Circuits and Systems for Instruments
Circuits and Systems for Machine Learning

Track 4: Circuits and Systems for Communication
Circuits and Systems for Equalization, Synchronization & Channel Estimation
Circuits and Systems for Signal Detection
Circuits and Systems for Coding and Modulation
Circuits and Systems for Communication Analysis and Reconstruction
Circuits and Systems for Wireless/Wireline Networking

Track 5: Design for Test & Reliability
SoC Test Methodology
Memory Test
Analog & Mixed Signal Circuits Test
Fault Tolerant Design
Aging Modeling & Mitigation
Data Acquisition & Confusion

Track 6: Power Electronic Circuits
Distributed Circuits and Systems
Power Line Analyzing & Modeling
Energy Storage Circuits
Energy Sources & Power Converter
Circuits and Systems for Smart Grid