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活动简介

The conference will provide an excellent platform for knowledge exchange between researchers, scientists, academicians and engineers working in the areas of engineering education. This event calls for local and international participation.

 

组委会

CHAIR

Norlida Buniyamin 

 

CO-CHAIR

Nina Korlina Madzhi

 

SECRETARY

Nurfadzilah Ahmad

 

FINANCE

Adizul Ahmad 

 

LOCAL ARRANGEMENT

A’zraa Afhzan Ab Rahim 

 

TECHNICAL PROGRAMME

Ng Kok Mun

 

PUBLICATION

Nina Korlina Madzhi

Noor Ezan Abdullah 

 

WEBSITE & PUBLICITY

Norashikin M. Thamrin

征稿信息

重要日期

2023-04-30
初稿截稿日期
2023-05-01
初稿录用日期
2023-07-01
终稿截稿日期

Dear our valued researchers/authors,

After the pandemic era, we are so excited to announce the new conference series of ICEED! Thus, you are cordially invited to present your current research in the 2023 IEEE 12th International Conference on Engineering Education (ICEED) that will be held in Kuala Lumpur, Malaysia from August 29–30, 2023. ICEED 2023 is organized by the IEEE Malaysia Education Society, co-organized by the Engineering and Technical Research Group (EnTER), School of Electrical Engineering, College of Engineering, Universiti Teknologi MARA, Malaysia, and technically co-sponsored by Harbin Institute of Technology, China.

The proceedings of ICEED 2023 may be eligible for inclusion in the IEEE Xplore® Digital Library (possibly indexed by Scopus), once they meet the requirements of an IEEE quality review.

征稿范围

  • Accreditation and evaluation
  • Engineering Education Reforms
  • International Recognition of Qualifications
  • New Technologies in Engineering Education
  • Industry and Education Collaboration
  • Globalisation in Education
  • Women in Engineering Education
  • Changes and Challenges in Engineering Education
  • Computer and Web-based software
  • Distance learning: methods, technologies, and assessment
  • Outcome-Based Education
  • Linking Academic Knowledge with the Industrial Needs
  • Research and development in Engineering Education
  • Quality Assurance in Engineering Education
  • Education in Applied Sciences
  • Education in Social Sciences
  • Education in Life Science

作者指南

Please prepare your manuscripts according to the IEEE Conference Paper format. The manuscript should be 4 to 6 pages long. You can visit ICEED 2023  Submission Page for more details.

Submission Page : https://enter.uitm.edu.my/iceed/submission/

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重要日期
  • 会议日期

    08月29日

    2023

    08月30日

    2023

  • 04月30日 2023

    初稿截稿日期

  • 05月01日 2023

    初稿录用通知日期

  • 07月01日 2023

    终稿截稿日期

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