It is our pleasure to extend a warm welcome to all delegates to participate in 2024 7th International Conference on Electronics Technology (ICET) which is yearly held at Chengdu, China. ICET 2024 will be from May 17th to 20th (Friday to Monday). It is co-sponsored by Sichuan Institute of Electronics and IEEE, technically co-sponsored by Chengdu Section, Chengdu Section AP/EMC Chapter, Chengdu Section SP Chapter, IEEE Chengdu Section SSC/CAS Joint Chapter, Sichuan Institute of Electronics, also with the support of University of Electronic Science and Technology of China, Sichuan University, Southwest Jiaotong University, Xi’an University of Technology, Singapore Institute of Electronics, Chengdu University of Technology, Chengdu University of Information Technology, etc.
The primary aim of ICET conference is to offer an academic platform for senior and young scientists worldwide to exchange research ideas, share knowledge, and discuss developments and experiences in the field of electronics, micro/nanoelectronics technology, and electronic packaging. The conference creates a multicultural atmosphere conducive to collaboration and learning. The other key aim of ICET is to provide postgraduate students with the opportunity to present their research findings to experts from academia and industry. This allows students to receive scholarly feedback and gain valuable insights. Additionally, the conference serves as a platform for university academics and industry professionals to engage with the technical community, share experiences, and benefit from the latest technological advancements presented at the event. We sincerely hope that all delegates can have fruitful and effective deliberations during the conference, leading to increased international cooperation.
Longjiang Deng, University of Electronic Science and Technology of China (Academician of Chinese Academy of Engineering)
Lalit Kumar Goel, Nanyang Technological University, Singapore (Fellow, IEEE)
Yuan Lin, University of Electronic Science and Technology of China
Shiwen Yang, University of Electronic Science and Technology of China (Fellow, IEEE)
Kama Huang, Sichuan University | Vice Chairman, Sichuan Institute of Electronics
Yuhua Cheng, Peking University (Fellow, IEEE)
Jiangtao Luo, Chongqing University of Posts and Telecommunications
Liangyin Chen, Sichuan University
Cui Meng, Zhejiang University
Frank He, Peking University
Gang Feng, University of Electronic Science and Technology of China
Weihao Hu, University of Electronic Science and Technology of China
Hui Li, University of Electronic Science and Technology of China
Weida Hu, Shanghai Institute of Technical Physics, Chinese Academy of Sciences
Haiying Dong, Lanzhou Jiaotong University
Junran Zhang, Sichuan University
Tao Jin, Fuzhou University
Xihua Zou, Southwest Jiaotong University
Xinyu Zhu, Civil Aviation Flight University of China
Tao Xiang, Secretary-General of Sichuan Institute of Electronics
Yongbo Liao, University of Electronic Science and Technology of China
Kaikai Xu, University of Electronic Science and Technology of China
Bo Zhang, Chengdu Technological University
Maoshen Tan, Southwest Petroleum University, China
Xinyu Wang, Sichuan Institute of Electronics, China
Tao Li, Xi'an University of Posts and Telecommunications
Jihang Deng, Sichuan University, China
Tianming Ma, Shanghai University of Engineering Science, China
Kai Wang, Southern University of Science and Technology
Zhongjie Guo, Xi'an University of Technology, China
Wang Yang, Xinjiang University, China
Jie Liu, Beijing University of Technology, China
Zhiwei Li, National University of Defense Technology, China
Jianjun Yang, University of North Georgia, Oakwood, USA
Li Xiang, Guilin University of Electronic Technology Guilin, China
Janelli M. Mendez, Lorma Colleges – Carlatan Campus, Philippines
Jun Wu, National University of Defense Technology, China
Wen-Sheng Zhao, Hangzhou Dianzi University, China
Changjiang Zhang, BNU-HKBU United International Colloge, China
Jian Zhu, Nanjing University, China
Guangnan Zhou, Crosslight Software Inc, Canada
Li Nannan, China Academy of Engineering Physics, China
Yu Xiao, Sun Yat-Sen University, Guangzhou, China
Zhaofeng Zhang, Shanghai Advanced Research Institute, Chinese Academy of Sciences Shanghai, China
Wang Yang, Xiangtan University, China
Wang Yuan, Peking University, China
Alireza Baghai-Wadji, University of Cape Town, South Africa
Jian Lv, UESTC, China
Teo Tee Hui, Singapore University of Technology and Design, Singapore
Somchat Sonasang, Nakhon Phanom University, Thailand
Donglin Wang, Zhengzhou University of Light Industry, China
Abdulati Abdullah, Azzaytuna University, Libya
Sheik Muhammed, University of Brunei, Brunei
Zhang Jinping, University of Electronic Science and Technology of China, China
Xinrong An, TCL Communication (Ningbo) Co., Ltd, China
Guanghu Jin, National University of Defense Technology, China
Ang Boon Chong, Intel, Malaysia
Hai-Wu Lee, Xiangsihu College of Guangxi University for Nationalities, China
Jinlong Li, Shanghai Institute of Measurement and Testing Technology, China
Chunyan Jiang, Shandong University of Political Science and Law, China
Zhiping Wan, Guangzhou Xinhua University, China
Guojun Jiang, East China University of Science and Technology, China
Lican Huang, Hangzhou DomainZones Technology Co.,Ltd.
Liao Wugang, Shenzhen University, China
Deshuang Zhao, University of Electronic Science and Technology of China, China
Hui Hou, Wuhan University of Technology, China
Issa Etier, Hashemite University, Jordan
Jinyan Wang, Peking University, China
Shiwen Lei, University of Electronic Science and Technology of China, China
Jianhong zhang, North China University of Technology, China
Yu Lu, Shenzhen Technology University, China
Yu Hongyu, Southern University of Science and Technology, China
TSUNG-MING LO, Nanfang College, China
Zhengchun Peng, Shenzhen University, China
Hailong Jiao, Peking University Shenzhen Graduate School, Shenzhen, China
Yi Luo, Micro/Nano Fabrication Laboratory, Microsystem & Terahertz Research Center Chineses Academy of Engineering Physics Chengdu, China
Zhou Hang, Peking University Shenzhen Graduate School, Shenzhen, China
Wang Wei, The Second Research Institute of CAAC, China
Xiaofeng Zhao, Xi'an High Tech Institute, China
Weifeng Sun, Southeast University
Qing Shen, Beijing Institute of Technology, China
Bo Qiu, Hebei University of Technology, China
Ahmed Boutejdar, German Research Foundation DFG, Microwave and Communication Engineering, Germany
Hao Wu, Beijing Jiaotong University, China
Dake Tian, Shenyang Jianzhu University, China
Bowen Xing,Shanghai Ocean University, China
Zhiyu Xi,Beihang University, Australian
Haldun M. Ozaktas, Bilkent University, Turkey
Guofeng Jiang, Air Force Engineering University, China
Peng Chen, Southeast University, China
Yong Luo, Shanghai University, China
Xi Wang, Xi'an University of Technology, China
Wai Tung Ng, University of Toronto, Canada
Mohd Sharizal Abdul Aziz, Universiti Sains Malaysia, Malaysia
Suhana Binti Mohd Said, University of Malaya, Malaysia
Niansong Mei, Shanghai Advanced Research Institute, Chinese Academy of Sciences, China
Muhammad Murtadha Othman,Universiti Teknologi MARA,Malaysia
Nuo Xu, National University of Defense Technology
Minghui Zhao, Tongji University & China Coal Technology & Engineering Group Shanghai Co., Ltd.
Guanghui Wang, Toronto Metropolitan University,Canada
Kok Chiang Liang, Newcastle Australia Institute of Higher Education
Muhammad Arshad Shehzad Hassan,The University of Faisalabad, Pakistan
Longjie Yu, TCL Communication (Ningbo) Co., Ltd, China
Zhifeng Zhang, Zhengzhou University of Light Industry, China
Yunqi Hao, Zhengzhou University of Light Industry, China
Zhang Shiling, State Grid Chongqing Electric Power Company, China
Chenhui Wang, Hydrogeology and Environmental Geology Survey, CGS, China
Lianggui Liu, Zhejiang Shuren University, China
Fengjuan Wang, Xi'an University of Technology, China
Yilin Sun, Beijing Institute of Technology, China
05月17日
2024
05月20日
2024
初稿截稿日期
注册截止日期
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