活动简介
The Institute of Electrical and Electronics Engineers - Components, Packaging and Manufacturing Technology Society (IEEE-CPMT) announces the 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials to be held at Atrium Hotel in Irvine, California from February 27th to March 1st, 2013
征稿信息
征稿范围
Adhesives and underfills - materials & applications, advanced processes, and reliability
Circuit boards, substrates, and dielectrics - advanced circuit boards and substrates, properties, and processing
Encapsulants, thin films, and coatings - material
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重要日期
-
会议日期
02月27日
2013
至03月01日
2013
-
03月01日 2013
注册截止日期
主办单位
Components, Packaging and Manufacturing Technology Society - CPMT
联系方式
- Sam Karikalan
- in******@atriumhotel.com
- 949*********
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