3D IC will cover all 3D IC topics, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and attendees to submit and interact with 3D researchers from all around the world. Papers are solicited in subject topics, including, but not limited to, the following: 3D IC Technology: Through Silicon Vias (TSV), wafer thinning, wafer alignment, wafer bonding, wafer dicing, 3D IC process, monolithic 3D integration, heterogeneous 3D integration, Capacitive coupling, Inductive coupling, multilevel epitaxial growth, etc. 3D IC Circuits Technology: 3D SOC, 3D Memory, 3D Processor, 3D DSP, 3D FPGA, 3D RF and microwave/millimeter wave, 3D analog circuits, 3D Biomedical circuits etc. 3D Applications: imaging, memory, processors, communications, networking, wireless, biomedical etc. 3D Design Methodology: 3D CAD, 3D synthesis, 3D design flows, Signal and power integrity analysis and design in 3D, 3D thermal design and analysis, test and design for test; 3D mechanical stress and reliability design and analysis, etc.
12月01日
2014
12月03日
2014
注册截止日期
2023年05月10日 爱尔兰 Cork
2023 IEEE International 3D Systems Integration Conference2021年10月26日 美国 Santa Rosa
2021 IEEE International 3D Systems Integration Conference2016年11月08日 美国
2016 IEEE International 3D Systems Integration Conference2016年11月08日 美国 San Francisco,USA
2016年IEEE国际3D系统集成会议2013年10月02日 美国
2013年IEEE国际3D系统集成会议
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