We are pleased to announce that the next International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) will take place in Dresden, Germany from April 20–23, 2015. The CICMT has been established for more than a decade as a global high-level platform for the presentation and discussion of the latest research and development results in the field of ceramic interconnection and microsystem technology. The CICMT 2015 is hosted by the Fraunhofer Institute for Ceramic Technologies and Systems IKTS and supported by the joint sponsorship of the International Microelectronics And Packaging Society IMAPS, the American Ceramic Society ACerS, IMAPS Deutschland and the German Ceramic Society DKG. The congress will be accompanied by an industrial exhibition.