AboutComponents, Circuits, Devices and Systems; Engineered Materials, Dielectrics and Plasmas; Fields, Waves and Electromagnetics; Photonics and Electrooptics
Keywords:Power Distribution Networks,Electronic Packaging,High-speed links,Analog-Mixed signal,Model Order Reduction,Macromodeling,Signal Integrity,Power Integrity,Power Distribution Networks,Electronic Packaging,3D Integration Packaging Technologies,Mixed Signal Applications,Transmission Line Theory,Integrated Circuit Modeling,Integrated Circuit Measurements,Printed Circuit Boards,Computer Aided Design,Optical Interconnects,AI in electronics design,
Scope:Characterization, modeling and design for signal and power integrity of electronic systems. Modeling, simulation and measurement of electrical interconnect performance at chip, board and package levels. Innovative CAD concepts and algorithms. Applications to computing devices, mobile devices, automotive/aerospace. Optical interconnection technology on component and board level.
Sponsor Type:1; 1; 1