Over the past sixteen years, this workshop has evolved into a forum of exchange on the latest research and developments on innovative schemes for signal and power integrity, and in the field of interconnect modeling, simulation and measurement at chip board and package levels. The workshop is also meant to bring together developers and researchers from industry and academia in order to encourage cooperation. In view of last year's success, the Committee is looking forward to the 17th Edition which will convene at the Hotel Concorde La Fayette in Paris, France.