2017 International Conference on Electronics Packaging ICEP

活动简介

YAMAGATA Prefecture in Japan is famous for its hot springs, beautiful frosted-covered trees as Great nature entertainment. Even among those, 7 cities and 7 towns are very attractive areas to enjoy sightseeing and nature. 'Yamagata MICE Navi' is a support application for participating in a convention and planning a business travel. 'MICE' is 'business travel' which now attracts worldwide attention, a newly coined word to combine head-letters from following words; Meeting, Incentive tour, Convention and Exhibition. What is the biggest difference form a package tour is original and special planning and service. Yamagata Prefecture has ideal facilities and events for business travel to hold convention such as international meetings or national tournaments, nothing other than attractive sightseeing and nature! 'Yamagata MICE Navi' willingly offer information for organizers and participants in Yamagata to feel comfortable and join conveniently.

Please prepare an abstract using the attached template to help us better evaluate your submission.The abstract should contain about 1 page of text and 1 page for supporting figures and tables, with a total length of 2 pages at maximum.
Figures and tables to support the point of the paper will receive positive considerations.Your abstract will be used for review purpose only and will not be included in the conference proceeding.
Thank you very much for your contribution!

征稿信息

重要日期

2016-09-30

摘要截稿日期

2017-01-31

初稿截稿日期

2016-11-20

初稿录用日期

2017-01-31

终稿截稿日期

征稿范围

1. Advanced Packaging
Wafer Level Packaging, System Integration, PoP, MCM, System on Package, Novel Assembly Technologies

2. Substrate and Interposers
Laminates, Interposers, Fine Pitch, Build-up Substrates, Flexible Printed Circuits, Embedded, Conductive Paste, Thin Core, Coreless, Low CTE

3. Interconnection
Bump Formation, Chip-Package Interaction, Low k, Leadframe, Test of First- and Second- Level Interconnections, Interconnections for 3D Integration, Interconnections in Substrates, PCBs and Systems

4. 3DIC Packaging
TSV, Via Formation and Filling, 2.5D, Wafer Thining, Silicon Stacking, Chip on Chip, Chip on Wafer, Wafer on Wafer, Wide Bus, Wireless Interconnection, Temporary Bonding/De-Bonding

5. Design, Modeling, and Reliability
Signal and Power Integrity, High Speed Board Design, Mechanical Design and Reliability, Failure Analysis, Fracture and Warpage in Packages, Testing, Evaluation, TCAD, 3DIC Design

6. Thermal Management
Advanced Cooling Modules, Heat Pipes, Heat Sinks, Fans and Blowers, Thermal Interface Materials, Thermal Measurements, Micro and Nano Scale Heat Transfer, Thermal Issues in Devices

7. Materials and Process
Novel Materials and Processing, Dielectrics, Emerging Materials and Processes for 3D, Thin Films, Underfills, Assembly Challenges and Solutions, Wefer Thinning, Plating, Equipment, Encapsulation

8. Printed Electronics
Inkjet, Screen Printing, Conductive Wiring, Insulation, Printed Organic TFTs, Device Applications

9. N-MEMS
NEMS-MEMS/Sensor Devices, MOEMS, Assembly and Packaging, Nano Technology, Nano Imprint Lithography, Organic Semiconductors, Wireless Sensor Networks

10. Optoelectronics
Active Optical Cable, Photonic Devices, Optical Fibers, Waveguides, Optical Interconnects, Transceivers, Connectors, LD/PD, LED, OE/EO, TOSA/ROSA, WDM, Optical Wiring Boards

11. Self-Organization/Self-Assembly
Biomimetics, Nature-Guided, Bottom-up Manufacturing, Smart Materials and Devices, Spontaneous Ordering/Patterning/Structuring, Self-Bonding/Debonding, Repairable, Self-Healing, Novel Micro/Nano Processing

12. Medical Devices
Invasive, Low Invasive, Non Invasive, In Vitro, BAN, Cure, Treatment, Diagnosis, Screening, POC, Healthcare

13. Power Electronics Integration
Si, SiC or GaN Power Device/Module Packaging; Packaging of High-temperature Power Electronics, Sensors; Inverters/Converters for Electric Vehicles; Magnetic Materials and Components; Substrate Technologies; Encapsulation Materials; PE Integration by 3D Printing

14. RF
RFID, High Frequency Devices, Packaging, Filters, EMI, EMC, Antennas, Wireless Power Transmission

15. Others
Market Trends, Environmentally Conscious Products and Processes, Cost Analyses