ITherm 2017 is the leading international conference for scientific and engineering exploration of thermal, thermo-mechanical and emerging technology issues associated with electronic devices, packages, and systems. ITherm 2017 will be held along with the 67th Electronic Components and Technology Conference (ECTC 2017, www.ectc.net), a premier electronic packaging conference, at the Disney World Resort. Joint registrations are available at a discounted rate. All papers will be peer reviewed by two or more reviewers, and will be published in the ITherm proceedings. Selected papers will be published in a special issue of Journal of Electronics Packaging. All papers will be presented in oral sessions. Students have the opportunity to apply for ITherm travel grants and make an oral presentation and also participate in poster presentation of their paper and compete for poster awards. In addition to paper presentations and vendor exhibits, ITherm 2017 will have panel discussions, keynote lectures by prominent speakers, and professional short courses.
Original papers are solicited in the following general areas of interest (but not limited to):
Thermal-1 Component Level --Track I
Single/Multi-Chip Module, System in Package
3D Packaging, Embedded Cooling
Heat Pipes, Vapor Chambers, Thermosyphons
Heat Spreaders
Hot Spot Cooling
Thermoelectric
Single & Two-Phase Cold Plates
Pumps, Fans
Heat Exchangers, Air Cooling
Thermal-2 System Level --Track II
Data Center, Energy Efficiency
Thermal Storage
Immersion Cooling, Refrigeration
Mobile, Internet of Things, MEMS
Telecommunication Systems
Automotive
Space and Aerospace
Power Electronics
LEDs
Photovoltaics
RF Electronics
Battery
Mechanics & Reliability --Track III
Thermo-mechanical Modeling and Simulation of Devices, Components, Boards, and Systems
Mechanics and Reliability of Solder Joints & Interconnects
Materials Characterization, Processing, Constitutive Models
Failure Mechanics, Fatigue, Damage Modeling
Experimental Techniques for Packaging Deformations, Strains, and Stresses
Shock, Drop, and Vibrational Analysis of Packages, SubSystems, and Systems
TSV / 3D Reliability and Packaging Challenges
Mechanics issues in Assembly and Manufacturing
Emerging Technologies & Fundamentals --Track IV
Numerical Methods from Nano-to-Macro Scale
Experimental Methods from Nano-to-Macro Scale
Nanotechnology incl. 1&2-Dimensional Materials
Thermal Interface Materials, Phase Change Materials
Embedded Cooling
Transistor Technology
Novel Materials and Manufacturing Techniques
Measurement and Instrumentation Techniques
Prognostic Health Management and Reliability Analysis
05月30日
2017
06月02日
2017
注册截止日期
初稿截稿日期
2031年05月27日 美国 Dallas
2031 30th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2028年05月30日 美国 Dallas
2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2021年06月01日 美国 San Diego
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2020年05月26日 美国 Orlando
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2019年05月29日 美国
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2018年05月29日 美国
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2016年05月31日 美国 Las Vegas, USA
2016年第15届IEEE 电子系统中导热和热机械现象会议2014年05月27日 美国
2014 IEEE 电子系统的热和热力学现象会议
留言