活动简介

Please download the Full Advance Program or the Advance Technical Program today. Registration is now open; once you are registered, we can provide a Visa Interview letter, to assist in your travels to the USA. Sponsored by the IEEE’s CPMT Society, ITherm 2016 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2016 – http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount. In addition to Oral and poster presentations and vendor exhibits, ITherm 2016 includes panel discussions, keynote lectures by prominent speakers, a “Cutting Edge Vendors” session, a Workshop on the Industrial Internet, and professional short courses.

征稿信息

征稿范围

Original papers are solicited in the general areas of
(but not limited to): 
Thermal Management:
 Novel Materials: Thermal Vias, Heat Spreaders and
Thermal Interface Materials
 Natural and Forced Convection Air Cooling
 Advances in Compact Air Movers
 Single-Phase Liquid Cooling
 Novel Phase Change Cooling Techniques: Boiling, Heat
Pipes, Thermosyphon, Spray and Jet Impingement
 Microfabricated Thermal Management Devices and
Systems
 Sub-Ambient Cooling: Solid State, Vapor Compression,
Absorption, Adsorption, Thermo-acoustic,
Magnetocaloric 
 Thermal Management in Wireless, Networking,
Computing, Lighting, Harsh Environments, and
Peripheral Hardware.
 Thermal and Energy Management in Data Centers
 Three-Dimensional Electronics
 Advances in Experimental Characterization
 Advances in Computational Characterization: MultiScale Modeling, Compact Modeling, Multi-Physics
Modeling, 
Multi-Objective Design and Optimization
Mechanics:
 Modeling and Simulation for Reliability at Package,
Board, and System Levels
 Failure Mechanics and Damage Modeling
 Experimental Techniques
 Constitutive Models
 Impact, Drop and Vibrational Analysis of Packages, 
Sub-Systems, and Systems
 Solder Profile Modeling, Fatigue Mechanics of
Packages, Interconnects
 Materials Characterization, Simulation, Design
Emerging Technologies:  
 Sensors (Medical, Military, Consumer, Structures,
Diagnostic, etc.)
 Nanotechnology: Thermal, Mechanics, Material and
Process Related Issues in Nanostructures
 Micro-Fluidics
 Fiber-Optics Interconnect Systems & Free Space 
Optical Interconnects
 MEMS: Device and Package Level Reliability Issues
 Integrated Biochips and Bioelectronics
 Medical, Telecommunication, and Automotive Systems
 Space Systems: Earth Orbiting and Deep-Space Missions

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