Please download the Full Advance Program or the Advance Technical Program today. Registration is now open; once you are registered, we can provide a Visa Interview letter, to assist in your travels to the USA. Sponsored by the IEEE’s CPMT Society, ITherm 2016 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. ITherm 2016 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2016 – http://www.ectc.net), a premier electronics packaging conference. Dual-registration for ITHERM and ECTC is offered at a substantial discount. In addition to Oral and poster presentations and vendor exhibits, ITherm 2016 includes panel discussions, keynote lectures by prominent speakers, a “Cutting Edge Vendors” session, a Workshop on the Industrial Internet, and professional short courses.
Original papers are solicited in the general areas of
(but not limited to):
Thermal Management:
Novel Materials: Thermal Vias, Heat Spreaders and
Thermal Interface Materials
Natural and Forced Convection Air Cooling
Advances in Compact Air Movers
Single-Phase Liquid Cooling
Novel Phase Change Cooling Techniques: Boiling, Heat
Pipes, Thermosyphon, Spray and Jet Impingement
Microfabricated Thermal Management Devices and
Systems
Sub-Ambient Cooling: Solid State, Vapor Compression,
Absorption, Adsorption, Thermo-acoustic,
Magnetocaloric
Thermal Management in Wireless, Networking,
Computing, Lighting, Harsh Environments, and
Peripheral Hardware.
Thermal and Energy Management in Data Centers
Three-Dimensional Electronics
Advances in Experimental Characterization
Advances in Computational Characterization: MultiScale Modeling, Compact Modeling, Multi-Physics
Modeling,
Multi-Objective Design and Optimization
Mechanics:
Modeling and Simulation for Reliability at Package,
Board, and System Levels
Failure Mechanics and Damage Modeling
Experimental Techniques
Constitutive Models
Impact, Drop and Vibrational Analysis of Packages,
Sub-Systems, and Systems
Solder Profile Modeling, Fatigue Mechanics of
Packages, Interconnects
Materials Characterization, Simulation, Design
Emerging Technologies:
Sensors (Medical, Military, Consumer, Structures,
Diagnostic, etc.)
Nanotechnology: Thermal, Mechanics, Material and
Process Related Issues in Nanostructures
Micro-Fluidics
Fiber-Optics Interconnect Systems & Free Space
Optical Interconnects
MEMS: Device and Package Level Reliability Issues
Integrated Biochips and Bioelectronics
Medical, Telecommunication, and Automotive Systems
Space Systems: Earth Orbiting and Deep-Space Missions
05月31日
2016
06月03日
2016
注册截止日期
2031年05月27日 美国 Dallas
2031 30th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2028年05月30日 美国 Dallas
2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2021年06月01日 美国 San Diego
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2020年05月26日 美国 Orlando
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2019年05月29日 美国
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2018年05月29日 美国
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2017年05月30日 美国 Orlando
2017年第16期IEEE电子系统热和热机械现象会议2014年05月27日 美国
2014 IEEE 电子系统的热和热力学现象会议
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