Sponsored by the IEEE's CPMT Society, ITherm 2018 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems. The first ITherm Conference was held in 1988, making this the 30th year of the Conference Series. ITherm 2018 will be held along with the 66th Electronic Components and Technology Conference (ECTC 2018 - http://www.ectc.net), a premier electronics packaging conference at the Sheraton Hotel and Marina in San Diego. Joint registrations are available at a discounted rate. In addition to paper presentations and vendor exhibits, ITherm 2018 will have panel discussions, keynote lectures by prominent speakers, invited Tech Talks, and professional short courses.
Original papers are solicited in the following general areas of interest (but not limited to):
Component-Level Thermal Management
Single/Multi Chip Module & System in Package
3D Packaging & Embedded Cooling
Hotspot & Impingement Cooling
Passive Two-Phase Cooling: Heat Pipes, Vapor Chambers, & Thermosyphons
Pulsating/Oscillating & Non-conventional Heat Pipes
Thermal Interface Materials and Heat Spreaders
Thermoelectricity & Peltier Devices
Novel Air Cooling Techniques & Heat Exchangers
Pumps, Compressors, Fans & Blowers
Single-Phase Liquid & Two-Phase Cold Plates
Boiling/Evaporation/Condensation, Microgap Cooling
System-Level Thermal Management
Data Center Energy Efficiency
Thermal Storage
Immersion Cooling, Refrigeration
Mobile, Internet of Things, MEMS
Telecommunication Systems
Automotive
Space and Aerospace
Power Electronics
LEDs
Photovoltaics
RF Electronics
Batteries
Mechanics & Reliability
Thermo-Mechanical Modeling and Simulation of Devices,
Components, Boards, and Systems
Mechanics and Reliability of Solder Joints & Interconnects
Materials Characterization, Processing, Constitutive Models
Failure Mechanics, Fatigue, Damage Modeling
Experimental Techniques for Packaging Deformations, Strains, and Stresses
Shock, Drop, and Vibrational Analysis of Packages, Sub- Systems, and Systems
TSV / 3D Reliability and Packaging Challenges
Mechanics Issues in Assembly and Manufacturing
Applied Reliability for Failure Detection and Characterization
Process-Structure-Property Correlations / Multi-Scale
Analyses for Degradation and Failure
Accelerated Stress Testing and Modelling
Lifetime Prognostics and Condition Monitoring
Emerging Technologies and Fundamentals
Numerical Methods from Nano-to-Macro Scale
Experimental Methods from Nano-to-Macro Scale
Nanotechnology Including 1-D and 2-D Materials
Thermal Interface Materials and Phase Change Materials
Embedded Cooling
Transistor Technology
Novel Materials and Fabrication Techniques
Measurement and Instrumentation Techniques
Prognostic Health Management and Reliability Analysis
Flexible Electronics
05月29日
2018
06月01日
2018
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