Sponsored by the IEEE's Electronics Packaging Society (EPS), ITherm 2021 is an international conference for scientific and engineering exploration of thermal, thermomechanical and emerging technology issues associated with electronic devices, packages and systems.
ITherm 2021 will be held virtually. In addition to paper presentations and vendor exhibits, ITherm 2021 will include, keynote lectures by prominent speakers, invited technology talks, networking opportunities and a student design competition.
All papers will be peer reviewed and published in the ITherm proceedings.
Sponsor Type:1
Leadership Team
General Chair
Justin Weibel
Purdue University
Program Chair
Dustin Demetriou
IBM
Vice Program Chair
Satish Kumar
Georgia TechAshish Gupta
Communication Chair
Ashish Gupta
Intel Corporation
Component-Level Thermal Management
Chair
Kamal Sikka
IBM
Co-Chair
Stephanie-Allard
IBM
Co-Chair
Darin Sharar
Army Research Labs
Original manuscripts on Thermal and Thermomechanical Phenomena in Electronic Systems are welcome.
06月01日
2021
06月04日
2021
初稿截稿日期
终稿截稿日期
注册截止日期
2031年05月27日 美国 Dallas
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2028 27th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2020年05月26日 美国 Orlando
2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2019年05月29日 美国
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2018年05月29日 美国
2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems2017年05月30日 美国 Orlando
2017年第16期IEEE电子系统热和热机械现象会议2016年05月31日 美国 Las Vegas, USA
2016年第15届IEEE 电子系统中导热和热机械现象会议2014年05月27日 美国
2014 IEEE 电子系统的热和热力学现象会议
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